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SUPPLIER : Taiwan Plant

GENERAL: We strongly propose Tg 150 instead of Tg 140 with better heat resistance and similiar price .The other attractive product is High Tg Laminate,applied for Burning Board/HDI parts.

PRODUCT SPECIFICATION:

Product

Item

YA-800/YA-832

(Licensed from IBM’s Driclad)

N0-Flow

YA-500 5U/7U

 GL 300
Peel Strength(lb/in) 1oz

> 8

> 9

>9

 >7
Water Absorption (%)

< 0.2%

< 0.3%

< 0.3%

 <0.25%
Volume Resistivity (Ω-cm)

> 1x 10 14

> 1x 10 8

> 1x 10 10

 10 14 ~ 10 15
Surface Resistivity (Ω)

> 1x 10 14

> 1x 10 8

> 1x 10 10

 10 14 ~ 10 15
Dielectric Constant (Dk)

4.1

4.4~4.5

4.2~4.8

 4.2~4.9
Loss Factor (Df)

<0.02

<0.02

<0.02

 <0.01
Solder Float at 288℃

> 180 sec

> 120 sec

> 120 sec

 > 120 sec
Tg

180℃

140℃

150℃/ 170℃

 130℃
Flammability

UL 94-V0

UL 94-V0

UL 94-V0

 UL 94-V0
Special Features

1. Less moisture

2. Excellent dimensional stability

3. Excellent copper adhesion at high temperature

4. High prepreg shelf life (6 months)

1. Good adhesion

2. Easy operation

3. Easy storage

1. Good heat resistance

2. Good dimensional stability

1.Halogen free

2.Good thermal resistance
Application

PBGA/Flip Chip substrate

Burn-in board

HDI

Heat sink

Rigid-Flex

Multilayer PCB HDI

 For green PCB

Please Email us for further information.

　

　

　

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Copyright © 2001 Y-Alliance Tech Corp.
Last modified: 2001-01-03