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Supplier : China Plant

Product : UV-blocking Copper Clad Lamintae

Features: High Tg>140C UV-Blocking and suitable for AOI

Application: For Fine Line SMT Appliances & Thin Core of High Reliability Multilayer Circuit Boards.

General Specifications
Laminate Thickness 0.1~3.2 mm 4~125 mil
Copper Clad 0.5 oz

1.0 oz

2.0 oz

18 um

35 um

70 um
Size 36"x48"

40"x48"

42x48"

 914 x 1220 mm

1016 x 1220 mm

1067 x 1220 mm

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Test Properties

Test Item              Test Condition        Unit                                   Value             
Peel Strength E-1/125 N/mm >0.7
Surface Resistance E-24/125 M-Ohm >1000
Volume Resistivity E-24/125 M-Ohm-Cm >1000
Dielectric Breakdown D-48/50+D-1/2/23 KV >40
Thermal stress 288c A s >10
Flammability UL-94 ¡@ V-0
Arc Resistance D-48/50+D-1/2/23 s >60
Loss Tangent at 1 MHz C-40/23/50 ¡@ <0.035
Permissible variation

in Length or width

 ¡@ mm ±3.2
Bow & Twist A % 1

Please email me for detail information of   above laminates and other laminate/bonding sheet.

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Copyright © 2001 Y-Alliance Tech Corp.
Last modified: 2001-01-03